PI adhesive tape with Fluorine release liner

high temperature insulation tape. for die cutting.This item is used for SMD packing and transformer manufacturing.

Application:  This item is used for SMD packing and transformer manufacturing. Can be used for die cutting

Specification: 1. Polyimide base film coating with high temperature Silicone adhesive. One side with Fluorine release film

             2. High temperature and corrosion resistance;

             3. Strong adhesion;

             4. Soft and proper and no residue after peeling off.

             5. For electronic manufacturing industry.